Paper
11 August 2008 3D profilometer employing white-light interferometry for microstructures with large-bevel inclines in brightness-enhanced films
Wei Cheng Wang, Yan Jen Su, Shih Hsuan Kuo
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Abstract
This study employed white-light interferometry to measure the three-dimensional (3D) profiles, roughness, and dimensions of brightness-enhanced films (BEFs) that exhibited roof-shaped profiles with large-bevel inclines that could not be successfully measured by conventional optical inspection. A scanning white-light interferometer (SWLI) was used to obtain image information from both the symmetrical sides of inclines in the BEFs. A feasible structure with an angle-tuning mechanism was also introduced to enable the scanning white-light interferometer to rotate the angle of vision according to the bevel angle of the incline in the BEF. Further, the profiles of the BEFs could be reconstructed successfully through a series of image processing techniques. Now, the allowable bevel angle of the inclines in the BEF is not greater than 45°. The experimental results confirmed that this approach can successfully measure the 3D profiles of large-bevel inclines of microstructures as well as the roughness and dimensions of BEFs.
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Wei Cheng Wang, Yan Jen Su, and Shih Hsuan Kuo "3D profilometer employing white-light interferometry for microstructures with large-bevel inclines in brightness-enhanced films", Proc. SPIE 7063, Interferometry XIV: Techniques and Analysis, 70630Z (11 August 2008); https://doi.org/10.1117/12.797595
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KEYWORDS
Interferometers

3D image processing

3D metrology

3D microstructuring

Calibration

Interferometry

Objectives

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