EUV Mask Repair
SEM CD Metrology
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PMJ panel discussion overview on mask complexities, cost, and cycle time in 32-nm system LSI generation: conflict or concurrent?
Impact of the OMOG substrate on 32 nm mask OPC inspectability, defect sensitivity, and mask design rule restrictions
Integrating Cr and MoSi etch for optimal photomask critical dimension uniformity and phase uniformity
Don't kill canaries! Introducing a new test device to assess the electrostatic risk potential to photomasks
Results obtained with the CHARPAN Engineering Tool and prospects of the ion Mask Exposure Tool (iMET)
Effects of heated substrates on bimetallic thermal resist for lithography and grayscale photomask applications
Evaluation of Double Process Lithography (DPL) with bi-layer photo-resist process for contact layer-patterning
Advanced mask technique to improve bit line CD uniformity of 90 nm node flash memory in low-k1 lithography
Crystal growth printability in an advanced foundry FAB: a correlation study between STARlight and ultra broadband BrightField inspection technologies
Detection of progressive transmission loss due to haze with Galileo mask DUV transmittance mapping based on non imaging optics
A new paradigm for haze improvement: retardation of haze occurrence by creating mask substrate insensitive to chemical contamination level
Evaluating practical vs. theoretical inspection system capability with a new programmed defect test mask designed for 3X and 4X technology nodes