Today reticle costs become one of the main contributors in the cost of manufacturing of advanced logic products.
Especially for low volume projects as of product sampling as well as design and product verifications the saving of
reticle costs becomes worthwhile. Multi level reticles are the combination of more then one lithographical layer on one
physical reticle. Due to this approach the physical amount of reticles per tape out will be reduced and thereby also the
costs for reticles will be significantly decreased. The multi level reticle approach is implemented as standard option in
the INFINEON Technologies tape out flow for advanced logic products. This means dependent on forecasted volume
and chip size it could be decided to tape out a project on multi level- or single level reticle. Technical setup, reticle
layout, specification, CAD flow and experience in daily work using multi level reticles in different design nodes will be
shown. Reticle cost advantage versus reduced throughput will be discussed.