17 October 2008 True reticle cost saving by multi level reticle approach
Author Affiliations +
Abstract
Today reticle costs become one of the main contributors in the cost of manufacturing of advanced logic products. Especially for low volume projects as of product sampling as well as design and product verifications the saving of reticle costs becomes worthwhile. Multi level reticles are the combination of more then one lithographical layer on one physical reticle. Due to this approach the physical amount of reticles per tape out will be reduced and thereby also the costs for reticles will be significantly decreased. The multi level reticle approach is implemented as standard option in the INFINEON Technologies tape out flow for advanced logic products. This means dependent on forecasted volume and chip size it could be decided to tape out a project on multi level- or single level reticle. Technical setup, reticle layout, specification, CAD flow and experience in daily work using multi level reticles in different design nodes will be shown. Reticle cost advantage versus reduced throughput will be discussed.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas Struck, Hendrik Kirbach, "True reticle cost saving by multi level reticle approach", Proc. SPIE 7122, Photomask Technology 2008, 712233 (17 October 2008); doi: 10.1117/12.800920; https://doi.org/10.1117/12.800920
PROCEEDINGS
7 PAGES


SHARE
RELATED CONTENT

Multi-layer masks: manufacturability considerations
Proceedings of SPIE (June 28 2005)
AutoMOPS B2B and B2C in mask making mask...
Proceedings of SPIE (April 09 2001)
E-beam direct write is free
Proceedings of SPIE (October 30 2007)
Automatic Creation of Stepper Job Files
Proceedings of SPIE (July 25 1989)

Back to Top