17 October 2008 The study of CD behavior due to transmission control position change within photomask substrate
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Abstract
As design rule of memory device is smaller and smaller, the CD uniformity of a photomask become the most important factor to satisfy wafer exposure performance. Once the photomask is made, CD uniformity of the mask can't be changed and if CD uniformity of the mask is not good to use for wafer exposure, we must reject it and make another one again. But, after applying transmission control tool for CD uniformity, we have an extra chance to control mask CD uniformity in one mask and this is very effective for wafer printing result. In this paper, we are going to evaluate the behavior of wafer CD due to transmission control position change within photomask substrate and find the optimum control position for better wafer result.
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Munsik Kim, Munsik Kim, Hyemi Lee, Hyemi Lee, Sungha Woo, Sungha Woo, Kangjoon Seo, Kangjoon Seo, Yongkyoo Choi, Yongkyoo Choi, Changyeol Kim, Changyeol Kim, } "The study of CD behavior due to transmission control position change within photomask substrate", Proc. SPIE 7122, Photomask Technology 2008, 712239 (17 October 2008); doi: 10.1117/12.801432; https://doi.org/10.1117/12.801432
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