New method of thin-film thickness measurement in wavelength scanning interferometry

Y. M. Hwang; J. S. Lee; H. J. Pahk

doi:10.1117/12.819572

31 December 2008 New method of thin-film thickness measurement in wavelength scanning interferometry

Y. M. Hwang, J. S. Lee, H. J. Pahk

Proceedings Volume 7130, Fourth International Symposium on Precision Mechanical Measurements; 71300Z (2008) https://doi.org/10.1117/12.819572
Event: Fourth International Symposium on Precision Mechanical Measurements, 2008, Anhui, China

Abstract

Thickness of thin film measurement is a important information for the TFT-LCD and semiconductor process, ranging from spectro-photometry to interferometry. In particular many efforts have been devoted for development of measurement system to obtain thickness and surface profile. In this paper, we propose a new method by using wavelet transform to retrieve the phase information, and we demonstrate, with both theoretical and experimental data, that this method provides a reliable technique for retrieving phase in the wavelength scanning interferomety. Also we show that the proposed method can reconstruct the non linear phase better than other methods such as the conventional fourier transform and direct spectral phase calculation method. In the experimental data, we verify that the error of measurement using proposed method is less than those other methods. The patterned thin film is measured with the proposed method to obtain the thickness profile and surface profile simultaneously, demonstrating higher accuracy and performance.

Citation Download Citation

Y. M. Hwang, J. S. Lee, and H. J. Pahk "New method of thin-film thickness measurement in wavelength scanning interferometry", Proc. SPIE 7130, Fourth International Symposium on Precision Mechanical Measurements, 71300Z (31 December 2008); https://doi.org/10.1117/12.819572

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