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31 December 2008 Recent developments of digital speckle pattern interferometry for full-field strain measurement
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Proceedings Volume 7130, Fourth International Symposium on Precision Mechanical Measurements; 71302W (2008) https://doi.org/10.1117/12.819663
Event: Fourth International Symposium on Precision Mechanical Measurements, 2008, Anhui, China
Abstract
Digital Speckle Pattern Interferometry (DSPI), originally known as electronic speckle pattern interferometry (ESPI), is an interferometry based method that allows whole field, non-contacting measurement of microscopic deformation, and thus exact determination of strain distribution. This paper gives a review of the technique for three dimensional (3D) deformation and strain measurement with constant and variable measuring sensitivity, and presents the recent developments for absolute phase measurement. The theory and methodology for the developments are given. Experimental results are used to demonstrate potentials and limitations for material characterization.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lianxiang Yang, Yonghong Wang, and Dan Thomas "Recent developments of digital speckle pattern interferometry for full-field strain measurement", Proc. SPIE 7130, Fourth International Symposium on Precision Mechanical Measurements, 71302W (31 December 2008); https://doi.org/10.1117/12.819663
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