31 December 2008 Optical method for testing of the packaging reliability of IC chips
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Proceedings Volume 7130, Fourth International Symposium on Precision Mechanical Measurements; 71304D (2008) https://doi.org/10.1117/12.819717
Event: Fourth International Symposium on Precision Mechanical Measurements, 2008, Anhui, China
Abstract
This paper describes a very simple and reliable procedure for testing packaging reliability of integrated circuits (IC) chips with a single optical experimental set-up. The procedure is based on the principle that it is possible to test minuteness displacement and thermal deformation with electronic speckle pattern interferometer (ESPI) techniques. The chips' direct performance of packaging reliability is their heat reliability. Therefore, heat reliability is firstly tested and then their packaging reliability is speculated. Two similar kinds of chips are chosen as specimens. In the experiment, the speckle pictures of specimens with five groups of equivalent input heat are obtained respectively, and meanwhile their corresponding surface temperature is measured. Disposing pattern stripes and calculating the heat source temperature show that both their off-surface displacement deformation and temperature are obviously different. From the experimental data, the simulation curve of off-surface displacement with temperature is plotted. Analyzing the changes of fitting curve testify that the chip with lower rate is of high reliability. The results justify that using ESPI could simply test packaging reliability of chips. This fact along with the exact knowledge of thermal deformation may be more useful for understanding heat stress. Moreover, this approach is characterized by fastness, reliability and real-time, and is therefore a quite effective tool for reliability analysis of microelectronic devices.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xianming Xiong, Xianming Xiong, Li Huang, Li Huang, Yanxiong Lin, Yanxiong Lin, } "Optical method for testing of the packaging reliability of IC chips", Proc. SPIE 7130, Fourth International Symposium on Precision Mechanical Measurements, 71304D (31 December 2008); doi: 10.1117/12.819717; https://doi.org/10.1117/12.819717
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