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30 December 2008 Photothermal measurement of absorption and wavefront deformations in fused silica
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'Thermal lenses' in fused silica due to absorbed UV laser radiation can diminish the achievable spatial resolution of the lithographic process in semiconductor wafer steppers. We developed a measurement system for spatially resolved registration of induced wavefront deformations, utilizing a Hartmann-Shack wavefront sensor with extreme sensitivity (λ/10,000). The photo-thermal technique can be employed for a rapid assessment of the material quality, since the wavefront deformation is directly proportional to the absorption losses. Along with a description of this new technique, we present results from photo-thermal measurements on fused silica under 193nm irradiation, as well as a comparison with thermal theory.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
K. Mann, A. Bayer, J. Gloger, U. Leinhos, T. Rousseau, and B. Schäfer "Photothermal measurement of absorption and wavefront deformations in fused silica", Proc. SPIE 7132, Laser-Induced Damage in Optical Materials: 2008, 71321F (30 December 2008);

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