Paper
18 November 2008 Packaging and thermal characteristics of Epi-down bonded uncooled pump lasers
Author Affiliations +
Proceedings Volume 7135, Optoelectronic Materials and Devices III; 71353A (2008) https://doi.org/10.1117/12.802942
Event: Asia-Pacific Optical Communications, 2008, Hangzhou, China
Abstract
High-power single-mode 980nm pump lasers are the key components in optical fiber amplifier. Thermal management for the telecom applications is a key design parameter for both package and system level. In this paper, based on the designed structural and material parameters of Epi-down bonded uncooled 980nm laser, the heat distribution of Epi-down bonded uncooled pump laser was simulated using the finite element method, and the photoelectric properties of designed and packaged module were tested. A fiber output power of 200mW was achieved for the Epi-down bonded uncooled 980nm laser with fiber Bragg grating, and module can work steadily over a wide temperature range of 0~70°C, with a small wavelength shift of 0.2nm, along with a FWHM less than 1.1nm, and a SMSR of more than 45dB.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bin Wu, Yi Li, Shuangshuang Hu, Qunjie Jiang, Xiaojing Yu, and Haifang Wang "Packaging and thermal characteristics of Epi-down bonded uncooled pump lasers", Proc. SPIE 7135, Optoelectronic Materials and Devices III, 71353A (18 November 2008); https://doi.org/10.1117/12.802942
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KEYWORDS
Laser bonding

Resistance

Fiber Bragg gratings

Fiber lasers

Finite element methods

Packaging

Fiber coupled lasers

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