9 February 2009 Investigation of transmission enhancement of THz radiation through subwavelength fractal structures of copper foils by FDTD simulation
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Abstract
We present the enhanced transmission spectrum of a copper foil with the sub-wavelength fractal structures by means of the terahertz time domain spectroscopy (THz-TDS) and FDTD simulation. In the view of experimental measurement and finite-difference-time-domain (FDTD) simulations, respectively, we studied the influence of the electric field and magnetic field on the enhanced transmission of THz wave through each level of fractal pattern generated by the repeated affine transformations of an H-shaped mother element on the copper foil. We simulate the incidence and transmission of the THz wave and show the propagation and distribution of the interior electromagnetic field by the software for electromagnetic design named CONCERTO. To compare with the experimental results, we simulate the cases that the certain levels of the pattern are deleted. The results of simulation agree with the experimental one. It is found that the transmission enhancement in the low frequency regime is caused by the radiation of electron resonance in the low fractal levels, and the transmission enhancement in the high frequency regime is caused by the radiation of electron resonance in the high fractal level, that is, the localization resonance of the fractal structures. These results indicate that the flat surface fractal structure like an ideal wave-guide. The vertically incident THz wave is confined on the surface and transmitted along the fractal slits. The controlling ability of fractal structures will offer a powerful tool for the design of THz photonic devices.
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Wei Meng, Wei Meng, Guozhong Zhao, Guozhong Zhao, Tianhua Meng, Tianhua Meng, Cunlin Zhang, Cunlin Zhang, } "Investigation of transmission enhancement of THz radiation through subwavelength fractal structures of copper foils by FDTD simulation", Proc. SPIE 7158, 2008 International Conference on Optical Instruments and Technology: Microelectronic and Optoelectronic Devices and Integration, 715814 (9 February 2009); doi: 10.1117/12.806215; https://doi.org/10.1117/12.806215
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