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23 February 2009 Laser brackets debonding: Tm:YAP, Nd:YAG, and GaAs diode lasers evaluation
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Proceedings Volume 7162, Lasers in Dentistry XV; 71620C (2009)
Event: SPIE BiOS, 2009, San Jose, California, United States
The study demonstrates the possibility of using laser radiation for the ceramic bracket removing. Three laser radiations were examined for this effect and the removing possibility and velocity together with enamel and root damage were investigated. A diode pumped Tm:YAP microchip laser generating a wavelength 1.9 μm, diode pumped Nd:YAG laser with 1.44 μm wavelength, GaAs diode with 0.808 μm were used for the debonding purpose. The measurement of transmission and absorption of the basic element - bracket, adhesive resin, and enamel was also made with the goal to explain the source of the heat and bracket debonding. The explanation of the debonding effect is also presented. From the results it is possible to conclude that continuously running diode pumped microchip Tm:YAP laser having output power 1W can be a good candidate for ceramic bracket debonding procedure.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tat'jana Dostálová, Helena Jelínková, Jan Šulc, Petr Koranda, Michal Němec, Ilja Ivanov, Mitsunobu Miyagi, and Katsumasa Iwai "Laser brackets debonding: Tm:YAP, Nd:YAG, and GaAs diode lasers evaluation", Proc. SPIE 7162, Lasers in Dentistry XV, 71620C (23 February 2009);


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