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23 February 2009 Packaging influence on laser bars of different dimensions
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The reliability of high-power diode laser bars is limited by the thermo-mechanical stress occurring during the packaging process and operation. The stress is caused by the mismatch of the thermal expansion coefficients between heat sink and laser bar. In general the stress influence grows with the bar size. The development of tapered laser bars leads to higher cavity lengths so the thermo-mechanical stress in the longitudinal direction becomes more important. In this work the packaging influences on different sized laser bars are compared. At first thermal and thermo-mechanical influences are evaluated in FEM-simulations. Afterwards laser bars of different lengths and widths are mounted and characterized. The occurring strain is analyzed by electroluminescence using the correlation between stress and polarization properties of the laser bar radiation. Because of the correlation between temperature and wavelength, a thermal analysis of the mounted laser bars can be done by emitter resolved spectra scanning. The influence on reliability is analyzed in an aging study with intermediate characterization steps.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas Westphalen, Michael Leers, Marcel Werner, Martin Traub, Hans-Dieter Hoffmann, and Ralf Ostendorf "Packaging influence on laser bars of different dimensions", Proc. SPIE 7198, High-Power Diode Laser Technology and Applications VII, 71980K (23 February 2009);


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