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23 February 2009 Material survey for packaging semiconductor diode lasers
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Abstract
We present results from a survey of materials used for packaging semiconductor lasers, including Cu, CuW, BeO, diamond composite and other advanced materials. We present the results of residual bonding stress from various solders and consider the direct effects on wavelength and spectral width. We also provide data on the second order effects of threshold current and slow axis divergence. Additionally, we consider the heat spreading through different materials for a laser bar and present modeled and experimental data on the thermal performance. Finally, we consider the reliability under on-off life-testing and thermal cycling tests.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David Schleuning, Kenneth Scholz, Mike Griffin, Bo Guo, Calvin Luong, Rajiv Pathak, Christian Scholz, Jason Watson, Heiko Winhold, and Tom Hasenberg "Material survey for packaging semiconductor diode lasers", Proc. SPIE 7198, High-Power Diode Laser Technology and Applications VII, 71981K (23 February 2009); https://doi.org/10.1117/12.809314
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