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24 February 2009 Advanced micromachining combining nanosecond lasers with water jet-guided laser technology
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This paper presents the first scribing results obtained by combining a short-pulse 10ns green laser with the water jet-guided laser technology. A number of high-potential applications are presented, from the grooving of low-k silicon wafers, the scribing of metallic and amorphous Si layers of thin film solar cells, the grooving of SiC wafers, and dot marking of Si wafers. The combination of a short pulse laser beam with the water jet-guided laser technology offers a new industry-proven alternative for grooving and scribing processes, providing superior speed and quality compared to legacy laser technologies.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
A. Pauchard, K. Lee, N. Vago, M. Pavius, and S. Obi "Advanced micromachining combining nanosecond lasers with water jet-guided laser technology", Proc. SPIE 7201, Laser Applications in Microelectronic and Optoelectronic Manufacturing VII, 72010A (24 February 2009);


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