24 February 2009 New packaging concepts for highly stable laser diode modules
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For mounting FAC lenses to diode lasers a new technology is introduced. Solder jet ball bumping is demonstrated to have the potential to replace conventional mounting technologies like adhesive bonding. The advantage of this method is a thermally and mechanically stable connection of micro optics and laser without drawbacks of outgasing and sensitivity to UV. The reached accuracy is within the range of one micrometer.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ekkehard Werner, Ekkehard Werner, Sabine Kretzschmar, Sabine Kretzschmar, Guido Bonati, Guido Bonati, Ramona Eberhardt, Ramona Eberhardt, } "New packaging concepts for highly stable laser diode modules", Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 720204 (24 February 2009); doi: 10.1117/12.809978; https://doi.org/10.1117/12.809978

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