Comprehensive laser beam characterization for applications in material processing

Klaus Mann; Armin Bayer; Maik Lübbecke; Bernd Schäfer

doi:10.1117/12.810515

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24 February 2009 Comprehensive laser beam characterization for applications in material processing

Klaus Mann, Armin Bayer, Maik Lübbecke, Bernd Schäfer

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Proceedings Volume 7202, Laser-based Micro- and Nanopackaging and Assembly III; 72020C (2009) https://doi.org/10.1117/12.810515
Event: SPIE LASE: Lasers and Applications in Science and Engineering, 2009, San Jose, California, United States

Abstract

With ever more stringent requirements regarding the quality of laser-supported production processes, measuring techniques for comprehensive characterization of laser beams and beam delivery optics are rapidly gaining importance. Of particular interest is precise knowledge regarding the beam profile, the beam propagation characteristics, and the wavefront. The latter describes the local direction of energy flux and carries detailed information about the beam aberrations, including intrinsic ones as well as those introduced by optical elements along the beam path. In this paper we give an overview of the status and current developments in the field of laser beam characterization. Examples from industrial applications are given, including the diagnostics of 193 nm excimer lasers. Along with a description of measuring procedures according to ISO standards, emphasis is placed on diagnostics based on Hartmann-Shack wavefront sensors. From the wavefront and the simultaneously recorded near-field profile beam parameters such as diameter, divergence, and M² can be evaluated in real-time. In addition, the approach also accomplishes prediction of the propagation behavior of the radiation field.

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Klaus Mann, Armin Bayer, Maik Lübbecke, and Bernd Schäfer "Comprehensive laser beam characterization for applications in material processing", Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 72020C (24 February 2009); https://doi.org/10.1117/12.810515

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