24 February 2009 Novel laser technologies for crystalline silicon solar cell production
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Abstract
Laser processes have penetrated into the crystalline silicon solar cell production market some time ago already, but are still far from reaching the status they probably will achieve one day. As the largest fraction of state-of-the-art production lines still produces conventional screen-printed aluminum back surface field (Al-BSF) cells, the applicability of lasers is currently limited mainly to the process step of laser edge isolation, while only a few other companies use lasers for groove formation (fabrication of laser grooved buried contact solar cells) or via hole drilling. Due to the contactless nature as well as the possibility to process a wide variety of materials with fine structures, lasers can be used for a vast field of production steps like ablating, melting and soldering different materials. Within this paper several applications of laser processes within the fabrication of various next-generation silicon solar cell structures are presented. These processes are for example laser via hole drilling, which is inevitable for MWT and EWT (metal and emitter wrap through) solar cells, LFC (laser-fired contacts) as a fast and easy approach for the production of passivated emitter and rear solar cells as well as laser ablation of dielectric layers and laser doping which offer the chance for industrial production of several different high efficiency solar cell structures.
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Andreas Grohe, Andreas Grohe, Annerose Knorz, Annerose Knorz, Jan Nekarda, Jan Nekarda, Ulrich Jäger, Ulrich Jäger, Nicola Mingirulli, Nicola Mingirulli, Ralf Preu, Ralf Preu, } "Novel laser technologies for crystalline silicon solar cell production", Proc. SPIE 7202, Laser-based Micro- and Nanopackaging and Assembly III, 72020P (24 February 2009); doi: 10.1117/12.810128; https://doi.org/10.1117/12.810128
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