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23 February 2009 Optical fiber packaging for MEMS interfacing
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An investigation study concerning positioning, alignment, bonding and packaging of optical fibers for interfacing with optical MEMS devices is being reviewed in this paper. The study includes a review of techniques and critical issues for optical fiber positioning, alignment, bonding, optical improvements, and coupling and interfacing through micro-lenses and waveguides. Also, we present a packaging design structure for hermetic sealing of optical MEMS devices requiring interfacing through optical fibers which considers aspects such as processes, assemble schemes and bonding techniques for Optical Fibers, which are briefly reviewed in this work. This packaging design considers the following conditions: hermeticity of the MEMS devices, optical fiber and MEMS die alignment and positioning, assembly process, and Simachined fixturing design for final assembly and positioning.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jose Mireles Jr., Miguel A. Garcia, Roberto C. Ambrosio, Ernest J. Garcia, Wilfrido Calleja, and Claudia Reyes "Optical fiber packaging for MEMS interfacing", Proc. SPIE 7204, Micromachining and Microfabrication Process Technology XIV, 720405 (23 February 2009);

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