9 February 2009 Fine leak batch testing of multiple MEMS packages
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Abstract
An analysis method for fine leak batch testing is developed for effective hermeticity inspection of metal-sealed MEMS packages in a mass production environment. It employs a forward-stepwise regression analysis based on a physical gas flow model to infer the information of leaky packages from batch test data. The proposed method can determine accurately the number of leaky packages and the true leak rate of each leaky package when the number of leaky packages in a batch is less than 5. A top-down hierarchical batch test is proposed as a reliable and effective test scheme by addressing this limitation of the developed analysis scheme.
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Changsoo Jang, Byeng Dong Youn, Suk-Jin Ham, Bongtae Han, "Fine leak batch testing of multiple MEMS packages", Proc. SPIE 7206, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII, 720605 (9 February 2009); doi: 10.1117/12.810004; https://doi.org/10.1117/12.810004
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