9 February 2009 Integration of InP-based optoelectronics with silicon waveguides
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Abstract
Compound semiconductors provide state-of-the-art performance in optoelectronics, while silicon-on-insulator (SOI) is an ideal platform for many passive functions in integrated optics. By combining them one can realise optical devices with high performance and low cost. This paper discusses the various applications and technologies for integrating InP chips with SOI waveguides. Bonding of lasers, SOA arrays and detectors for practical applications is described. Experimental results are given for visually aligned thermo-compression bonding and self-aligned flip-chip bonding with Indium bumps. Flip-chip bonding is reported directly on SOI chips, as well as on a separate silicon-optical-bench.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Timo Aalto, Timo Aalto, Mikko Harjanne, Mikko Harjanne, Markku Kapulainen, Markku Kapulainen, Sami Ylinen, Sami Ylinen, Jyrki Ollila, Jyrki Ollila, Ville Vilokkinen, Ville Vilokkinen, Ludwig Mörl, Ludwig Mörl, Martin Möhrle, Martin Möhrle, Régis Hamelin, Régis Hamelin, } "Integration of InP-based optoelectronics with silicon waveguides", Proc. SPIE 7218, Integrated Optics: Devices, Materials, and Technologies XIII, 72180O (9 February 2009); doi: 10.1117/12.808129; https://doi.org/10.1117/12.808129
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