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9 February 2009 Wafer-level optics enables low cost camera phones
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Abstract
To meet market demand and enable the proliferation of camera phones for developing countries, manufacturers must be able to meet requirements for camera modules that are reduced in size and cost. Conventional camera-module technology is heading towards an asymptote, where the optics no longer scale with the required size, performance, and cost. Using wafer-level techniques and reflow compatible materials to manufacture the optics together with wafer-level chip scale packaging (WLCSP) of image sensors enables manufacturing of smaller-size, lower-cost, reflow-compatible camera modules. Focusing on VGA resolution, this paper will present a comparison between optical modules that were built using conventional technology and wafer-level technology.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yehudit Dagan "Wafer-level optics enables low cost camera phones", Proc. SPIE 7218, Integrated Optics: Devices, Materials, and Technologies XIII, 72180P (9 February 2009); https://doi.org/10.1117/12.811609
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