Optical interconnects for board level applications

R. Dangel; R. Beyeler; N. Meier; T. Lamprecht; F. Horst; D. Jubin; J. Weiss; B. J. Offrein

doi:10.1117/12.811128

10 February 2009 Optical interconnects for board level applications

R. Dangel, R. Beyeler, N. Meier, T. Lamprecht, F. Horst, D. Jubin, J. Weiss, B. J. Offrein

Proceedings Volume 7219, Optoelectronic Integrated Circuits XI; 721904 (2009) https://doi.org/10.1117/12.811128
Event: SPIE OPTO: Integrated Optoelectronic Devices, 2009, San Jose, California, United States

Abstract

Optical link technology will play an increasingly important role for board-level interconnects in servers and supercomputers as a means to keep pace with the increasing intra-system bandwidth requirements. Low-cost and high density optical packaging concepts are required. We describe the development of board-level interconnects based on polymer waveguide technology. In this paper, we focus on flexible optical waveguide sheets and the passive alignment of optical connectors.

Citation Download Citation

R. Dangel, R. Beyeler, N. Meier, T. Lamprecht, F. Horst, D. Jubin, J. Weiss, and B. J. Offrein "Optical interconnects for board level applications", Proc. SPIE 7219, Optoelectronic Integrated Circuits XI, 721904 (10 February 2009); https://doi.org/10.1117/12.811128

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