Characterization and optimization of residual layer thickness during UV imprint process for singlemode waveguide fabrication

Shinmo An; Hyun-Shik Lee; Se-Guen Park; Beom-Hoan O; Seung-Gol Lee; El-Hang Lee

doi:10.1117/12.813482

10 February 2009 Characterization and optimization of residual layer thickness during UV imprint process for singlemode waveguide fabrication

Shinmo An, Hyun-Shik Lee, Se-Guen Park, Beom-Hoan O, Seung-Gol Lee, El-Hang Lee

Author Affiliations +

Proceedings Volume 7219, Optoelectronic Integrated Circuits XI; 72190R (2009) https://doi.org/10.1117/12.813482
Event: SPIE OPTO: Integrated Optoelectronic Devices, 2009, San Jose, California, United States

Abstract

We report on the fabrication and characterization of a residual layer resulting from UV imprinting of singlemode optical waveguide. We have measured the residual thickness formed from the imprinting process for several-um-size singlemode waveguide fabrication using the parameters of the imprinting pressure, dropped volume, and viscosity of the used polymer. We found that the residual layer thickness is dependent on both the initial polymer volume and process pressure and the initial polymer volume is more critical than process pressure. Viscosity of polymer also affects the residual layer thickness, the lowest residual layer thickness of 29nm is achieved with nano-imprinting resin, 0.3uL volume, and imprint pressure more than 20bar. Even with optical resin, the residual layer thickness of 60nm is achieved with 0.3uL volume and imprinting pressure of 30bar.

Citation Download Citation

Shinmo An, Hyun-Shik Lee, Se-Guen Park, Beom-Hoan O, Seung-Gol Lee, and El-Hang Lee "Characterization and optimization of residual layer thickness during UV imprint process for singlemode waveguide fabrication", Proc. SPIE 7219, Optoelectronic Integrated Circuits XI, 72190R (10 February 2009); https://doi.org/10.1117/12.813482

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