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12 February 2009 Three-dimensional optical lines fabricated onto substrate for on-board interconnection
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Abstract
Optical lines using polymer materials fabricated on an organic substrate with metal lines and pads are proposed to realize fully optical interconnections among high performance LSIs. This optical line enable transmit high speed optical signals not only on a plane surface but to vertical direction. It has following four particular portions; (1) Curved parallel optical waveguide; (2) 45 degree reflection mirror; (3) Optical via hole with coaxial structure; (4) Optical joint between package and board. The optical line characterized by transmission loss and passed through eye diagram, and good optical signal transmission is confirmed to really use for optical interconnection between LSIs. Then on-board optical signal transmission is demonstrated by that VCSEL and PIN-PD are assembled using flip-chip technology on a circuit board with other electric devices of driving circuit, and also package-to-board optical joint are demonstrated by passing through solder reflow process.
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Takahiro Matsubara, Keiko Oda, Keiichiro Watanabe, Maraki Maetani, Kaori Tanaka, and Shigeo Tanahashi "Three-dimensional optical lines fabricated onto substrate for on-board interconnection", Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 72210A (12 February 2009); https://doi.org/10.1117/12.806188
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