12 February 2009 Out-of-plane coupling using thin glass based arrayed waveguide components
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Nano-photonics and electrical-optical integration are rapidly growing fields with a strong potential for applications in a wide spectrum covering optical sensing, data & telecommunication. Its merit of ultra compactness and planarity becoming a challenge since the periphery remained micro-level and out-of-plane coupling becomes necessary. We introduce new planar optical coupling elements for electrical-optical circuit boards, sensors and nano-devices. The novel photonic packaging technology using thin glass foils bridge the growing field of nano-photonics to the micro-photonic periphery. Innovative features are added to this technique to leverage its generic usage and first experimental results are presented.
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H. Schröder, H. Schröder, L. Brusberg, L. Brusberg, N. Arndt-Staufenbiel, N. Arndt-Staufenbiel, T. Tekin, T. Tekin, } "Out-of-plane coupling using thin glass based arrayed waveguide components", Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 72210D (12 February 2009); doi: 10.1117/12.809546; https://doi.org/10.1117/12.809546

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