12 February 2009 Advances in high-power laser diode packaging
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Proceedings Volume 7221, Photonics Packaging, Integration, and Interconnects IX; 72210U (2009); doi: 10.1117/12.810549
Event: SPIE OPTO: Integrated Optoelectronic Devices, 2009, San Jose, California, United States
Abstract
High-power, packaged diode-laser sources continue to evolve through co-engineering of epitaxial design, beam conditioning and thermal management. Here we review examples of improvements made to key attributes including reliable power, brightness, power per unit volume and value.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ed Wolak, Cameron Mitchell, Trevor Crum, Oscar Romero, John Gloyd, Daming Liu, Serge Cutillas, Sang-Ki Park, Kelly Johnson, Xu Jin, Hanxuan Li, Terry Towe, Irving Chyr, Robert Miller, Arne Meissner, Dino Lenarduzzi, James Harrison, "Advances in high-power laser diode packaging", Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 72210U (12 February 2009); doi: 10.1117/12.810549; https://doi.org/10.1117/12.810549
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KEYWORDS
Fiber couplers

Diodes

High power lasers

Semiconductor lasers

Reliability

Heatsinks

Packaging

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