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12 February 2009 Advances in high-power laser diode packaging
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High-power, packaged diode-laser sources continue to evolve through co-engineering of epitaxial design, beam conditioning and thermal management. Here we review examples of improvements made to key attributes including reliable power, brightness, power per unit volume and value.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ed Wolak, Cameron Mitchell, Trevor Crum, Oscar Romero, John Gloyd, Daming Liu, Serge Cutillas, Sang-Ki Park, Kelly Johnson, Xu Jin, Hanxuan Li, Terry Towe, Irving Chyr, Robert Miller, Arne Meissner, Dino Lenarduzzi, and James Harrison "Advances in high-power laser diode packaging", Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 72210U (12 February 2009);


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