Using a combination of molecular beam epitaxy (MBE) and metal-organic, chemical-vapor deposition (MOCVD), highperformance,
buried-heterostructure, distributed feedback (DFB), laser diodes are being manufactured for multiple,
uncooled (-20 to 85 °C and -40 to 95 °C) product lines. MBE is used to grow the active regions and the p-type cladding
layers, while MOCVD is used for the Fe-doped blocking layers. Multi-wafer growths are used to reduce device costs.
Devices, employing the same basic active region design, have been fabricated operating at wavelengths from 1490 to
1610 nm for applications including coarse wavelength division multiplexing (CWDM) OC-48 digital, analog return path,
and 2.2 GHz (3G) wireless code division multiple access (W-CDMA). These devices show good linearity (analog
return path and wireless) and high-speed operation (digital). Accelerated lifetime testing of these devices shows
excellent reliability with a median lifetime of 17 years at 90 °C.