New 5.5 µm interline transfer CCD platform for applied imaging markets

Douglas A. Carpenter; James A. DiBella; Robert Kaser; Stephen L. Kosman; Xueyuan Liu; John P. McCarten; Eric J. Meisenzahl; David N Nichols; Christopher Parks; Thomas R. Pian

doi:10.1117/12.806389

Translator Disclaimer

27 January 2009 New 5.5 &mgr;m interline transfer CCD platform for applied imaging markets

Douglas A. Carpenter; James A. DiBella; Robert Kaser; Stephen L. Kosman; Xueyuan Liu; John P. McCarten; Eric J. Meisenzahl; David N Nichols; Christopher Parks; Thomas R. Pian

Author Affiliations +

Proceedings Volume 7249, Sensors, Cameras, and Systems for Industrial/Scientific Applications X; 72490C (2009) https://doi.org/10.1117/12.806389
Event: IS&T/SPIE Electronic Imaging, 2009, San Jose, California, United States

Abstract

A new 5.5 &mgr;m pixel interline transfer CCD technology platform has been developed that offers significant improvements in performance while retaining the dynamic range, quantum efficiency, and responsivity available from the previous generation 7.4 µm pixel. Smear has been reduced to -100 dB, and a new quad-output architecture increases the maximum frame rate up to 120 fps for a 1 MPix sensor. This technology is now being deployed across a family of image sensors that share a common package and pin-out, facilitating faster camera design and product commercialization.

Citation Download Citation

Douglas A. Carpenter, James A. DiBella, Robert Kaser, Stephen L. Kosman, Xueyuan Liu, John P. McCarten, Eric J. Meisenzahl, David N Nichols, Christopher Parks, and Thomas R. Pian "New 5.5 &mgr;m interline transfer CCD platform for applied imaging markets", Proc. SPIE 7249, Sensors, Cameras, and Systems for Industrial/Scientific Applications X, 72490C (27 January 2009); https://doi.org/10.1117/12.806389

ACCESS THE FULL ARTICLE