2 February 2009 Optimized features allocation technique for improved automated alignment of wafers
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Abstract
In this paper we present a new fuzzy logic based approach for automatic optimized features allocation. The technique is used for improved automatic alignment and classification of silicon wafers and chips that are used in the electronic industry. The proposed automatic image processing approach was realized and experimentally demonstrated in real industrial application with typical wafers. The automatic features allocation and grading supported the industrial requirements and could replace human expert based inspection that currently is performed manually.
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Michael Parshin, Zeev Zalevsky, "Optimized features allocation technique for improved automated alignment of wafers", Proc. SPIE 7251, Image Processing: Machine Vision Applications II, 72510V (2 February 2009); doi: 10.1117/12.804728; https://doi.org/10.1117/12.804728
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