Paper
17 November 2008 3-D measurement method based on wavelet transform by using SEM
Y. Arai, M. Ando, S. Yokozeki
Author Affiliations +
Proceedings Volume 7266, Optomechatronic Technologies 2008; 72660I (2008) https://doi.org/10.1117/12.806949
Event: International Symposium on Optomechatronic Technologies, 2008, San Diego, California, United States
Abstract
Three-dimensional measurement of micro-size products is performed by optical methods and/or SPM-technology. However, there are some problems in each method. In this paper, a novel three-dimensional measurement method for a micro size product is proposed by using the Wavelet transform and the electron-beam of SEM. To perform the measurement, the mechanism of producing shadows of the grid on the surface of the object by back scattering electron beam is discussed. The principle of measurement by using this phenomenon of shadows of grid is proposed. In experiment, a bearing ball whose diameter is 500μm is measured by a grating made of a silicon wafer. It can be confirmed that the standard deviation of this measurement is about 400nm.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Y. Arai, M. Ando, and S. Yokozeki "3-D measurement method based on wavelet transform by using SEM", Proc. SPIE 7266, Optomechatronic Technologies 2008, 72660I (17 November 2008); https://doi.org/10.1117/12.806949
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KEYWORDS
Scanning electron microscopy

Wavelet transforms

Fringe analysis

Sensors

Silicon

3D metrology

Scattering

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