Memory rich applications for 3D integration

Paul D. Franzon; Steven Lipa; Julie Oh; Thor Thorolfsson; Rhett Davis

doi:10.1117/12.810061

30 December 2008 Memory rich applications for 3D integration

Paul D. Franzon, Steven Lipa, Julie Oh, Thor Thorolfsson, Rhett Davis

Proceedings Volume 7268, Smart Structures, Devices, and Systems IV; 726809 (2008) https://doi.org/10.1117/12.810061
Event: SPIE Smart Materials, Nano- and Micro-Smart Systems, 2008, Melbourne, Australia

Abstract

3D stacking and integration can provide system advantages equivalent to up to two technology nodes of scaling. This paper explores memory rich applications for 3DIC. It shows how memory power and memory bandwidth can both be improved by an order of magnitude through 3D integration, and specifically explores a DSP application.

Citation Download Citation

Paul D. Franzon, Steven Lipa, Julie Oh, Thor Thorolfsson, and Rhett Davis "Memory rich applications for 3D integration", Proc. SPIE 7268, Smart Structures, Devices, and Systems IV, 726809 (30 December 2008); https://doi.org/10.1117/12.810061

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