30 December 2008 Memory rich applications for 3D integration
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Abstract
3D stacking and integration can provide system advantages equivalent to up to two technology nodes of scaling. This paper explores memory rich applications for 3DIC. It shows how memory power and memory bandwidth can both be improved by an order of magnitude through 3D integration, and specifically explores a DSP application.
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Paul D. Franzon, Steven Lipa, Julie Oh, Thor Thorolfsson, Rhett Davis, "Memory rich applications for 3D integration", Proc. SPIE 7268, Smart Structures, Devices, and Systems IV, 726809 (30 December 2008); doi: 10.1117/12.810061; https://doi.org/10.1117/12.810061
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