There are several applications either currently in production or in late stage R&D, for
UV-based Nanoimprint Lithography (UV-NIL) and Hot Embossing (HE) that require a
full-field imprint technology in order to make these processes either feasible or costeffective.
These applications cover a wide range of features sizes from the millimeter
range down to sub-100 nm. Because of the total thickness variation (TTV) associated
with the imprinted substrates, full-field imprinting requires fabrication of a "soft" or
"working" stamp from a "hard" stamp usually made from materials such as nickel, quartz
or silicon. Several materials and processes have previously been identified that allow for
full-field imprinting, however, these materials all have drawbacks associated with them
that hinder their movement into High Volume Manufacturing (HVM) environments. EV
Group Inc (EVG) has, in cooperation with our NILCOMTM partners, identified a novel set
of polymeric materials and stamp fabrication processes that allow for full-field imprinting
solutions suitable for these HVM environments. These materials have proven effective
for imprinting at both millimeter feature sizes all the way down to 50 nm - full field.
These materials, and the processes associated with their fabrication into working/soft
stamps, should allow for a superior cost-of-ownership benefit and facilitate the movement
of imprint lithography into industrial applications.