17 March 2009 Fabrication of metrology test structures for future technology nodes using high-resolution variable-shaped e-beam direct write
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Abstract
Electron beam direct write (EBDW) can be utilized for developing metrology methods for future technology nodes. Due to its advantage of high resolution and flexibility combined with suitable throughput capability, variable-shaped E-Beam lithography is the appropriate method to fabricate sub 40nm resist structures with accurately defined properties, such as critical dimension (CD), pitch, line edge roughness (LER) and line width roughness (LWR). In this study we present results of exposure experiments intended to serve as an important instrument for testing and fitting various metrology and defect density measurement methods for future technology nodes. We successfully fabricated sub 40nm gratings with varying CD, pitch, programmed defects and LER/LWR. First metrology measurements by means of optical scatterometry on these dense structures show that variation of the signal response is sufficient to detect sub 10nm fluctuations with a satisfying repeatability.
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László Szikszai, Philipp Jaschinsky, Katja Keil, Marc Hauptmann, Manfred Mört, Uwe Seifert, Christoph Hohle, Kang-Hoon Choi, Frank Thrum, Johannes Kretz, Vaeriano Ferreras Paz, Arie den Boef, "Fabrication of metrology test structures for future technology nodes using high-resolution variable-shaped e-beam direct write", Proc. SPIE 7271, Alternative Lithographic Technologies, 72712M (17 March 2009); doi: 10.1117/12.814181; https://doi.org/10.1117/12.814181
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