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18 March 2009 Monitor and self-diagnostic technology for mask e-beam writing system
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The accuracy of line-width control and image placement on mask has become a matter of serious concerns with continued reduction of design rules in semiconductor device fabrication. The smallest changes in environment during mask-exposure can cause significant damage to mask since these deviations result in increased mask cost because the number of times that a mask is repaired and reproduced increases. In the year 2006, Mask Design, Drawing, and Inspection Technology Research Department (Mask D2I) at the Association of Super-Advanced Electronics Technologies (ASET) launched a 4-year development program for the optimization of mask design, drawing, and inspection to reduce the manufacturing cost of photo-mask. In this program, we are developing a self-diagnostic technology that can monitor the process of data transfer and check the environment during exposure to improve the reliability of the mask writer. This technology, by detecting the process deviations before they occur can increase the efficiency of mask inspection.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Norihiko Samoto, Hironobu Manabe, Osamu Wakimoto, Satoshi Iida, Hiromichi Hoshi, and Masaki Yamabe "Monitor and self-diagnostic technology for mask e-beam writing system", Proc. SPIE 7271, Alternative Lithographic Technologies, 72712R (18 March 2009);

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