Role of CDAFM in achieving accurate OPC modeling

Vladimir A. Ukraintsev

doi:10.1117/12.815240

23 March 2009 Role of CDAFM in achieving accurate OPC modeling

Vladimir A. Ukraintsev

Proceedings Volume 7272, Metrology, Inspection, and Process Control for Microlithography XXIII; 727205 (2009) https://doi.org/10.1117/12.815240
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

Accuracy of patterning strongly impacts profit of IC manufacturing and depends on accuracy of optical proximity correction (OPC) and resolution enhancement technology (RET) models. Despite its importance accuracy of RET and OPC is not known in most cases. Accuracy of CDSEM which is used to build the models is questionable. Sample-to-sample bias variation of CDSEM is exceeding required sub-nanometer uncertainty budget. CDAFM could be used for reference and bias correction. Use of AFM in several areas of RET and OPC modeling is discussed. Accurate inputs and feedback during development reduce number of learning cycles and improve quality of the models.

Citation Download Citation

Vladimir A. Ukraintsev "Role of CDAFM in achieving accurate OPC modeling", Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 727205 (23 March 2009); https://doi.org/10.1117/12.815240

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