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23 March 2009 The measurement uncertainty challenge for the future technological nodes production and development
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Abstract
With the continuous shrinkage of dimensions in the semiconductor industry, the measurement uncertainty is becoming one of the major component that have to be controlled in order to guarantee sufficient production yield for the next technological nodes production. Thus, CD-SEM and Scatterometry techniques have to face new challenges in term of accuracy and subsequently new challenges in measurement uncertainty that were not really taken into account at the origin of their introduction in production. In this paper, we will present and discuss results about the accuracy requirements related to key applications for advanced technological nodes production. Thus, we will present results related to OPC model precision improvement by using suitable reference metrology model based on the 3D-AFM technique use. An interesting study related to 193 resist shrinkage during CD-SEM measurement will be also presented and therefore the impact on measurement uncertainty will be discussed. Finally we will conclude this paper by showing the potential industrial benefits to use a simple but relevant 3D-AFM reference metrology model use into the semiconductor production environment.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Foucher, P. Faurie, A.-L. Foucher, M. Cordeau, and V. Farys "The measurement uncertainty challenge for the future technological nodes production and development", Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72721K (23 March 2009); https://doi.org/10.1117/12.812446
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