You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
23 March 2009The measurement uncertainty challenge for the future technological nodes production and development
With the continuous shrinkage of dimensions in the semiconductor industry, the measurement uncertainty is becoming
one of the major component that have to be controlled in order to guarantee sufficient production yield for the next
technological nodes production. Thus, CD-SEM and Scatterometry techniques have to face new challenges in term of
accuracy and subsequently new challenges in measurement uncertainty that were not really taken into account at the
origin of their introduction in production.
In this paper, we will present and discuss results about the accuracy requirements related to key applications for
advanced technological nodes production. Thus, we will present results related to OPC model precision improvement by
using suitable reference metrology model based on the 3D-AFM technique use. An interesting study related to 193 resist
shrinkage during CD-SEM measurement will be also presented and therefore the impact on measurement uncertainty
will be discussed. Finally we will conclude this paper by showing the potential industrial benefits to use a simple but
relevant 3D-AFM reference metrology model use into the semiconductor production environment.
The alert did not successfully save. Please try again later.
J. Foucher, P. Faurie, A.-L. Foucher, M. Cordeau, V. Farys, "The measurement uncertainty challenge for the future technological nodes production and development," Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72721K (23 March 2009); https://doi.org/10.1117/12.812446