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23 March 2009 Automated overlay recipe setup in high-volume manufacturing: improving performance, efficiency, and robustness
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As the semiconductor industry continues to drive toward smaller design nodes, overlay error budgets will continue to shrink making metrology ever more challenging. Moreover, this challenge is compounded by the need to continue to drive down costs and increase productivity, especially given the competitive and macro-economic landscape going forward. In order to satisfy these two contradicting requirements, new ways of maintaining metrology tools and recipes are needed. Traditionally, recipes are generated manually by operators or even metrology engineers, involving both tool time and engineering resources. Furthermore, the influence of individual skill levels can lead to undesirable variations and is a potential source of errors that could result in yield loss. By means of automatic recipe generation both engineering and capital equipment resources can be minimized. Implementation of an automated recipe creation process will also result in improved recipe integrity. In this study, we show a methodology of a highly automated recipe generation for overlay measurements. We will outline the benefits of such an implementation and comment on the value for all segments of the semiconductor industry as well as provide data from production fabs demonstrating these capabilities and benefits.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christian Sparka, Anna Golotsvan, Yosef Avrahamov, Wolfgang Sitzmann, and David Tien "Automated overlay recipe setup in high-volume manufacturing: improving performance, efficiency, and robustness", Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 727232 (23 March 2009);

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