Paper
23 March 2009 Development of a novel methodology for effective partial die inspection and monitoring
Author Affiliations +
Abstract
Defect inspection is a challenge in the edge of wafer region and several new inspection tools and techniques have come to the market to fulfill this inspection need. Current inspection methodology excludes inspection of partial die located at the wafer edge, which has lead to the development of a technique available for patterned wafer inspection tools to inspect these partially printed die. In this paper we identify and develop a robust methodology for the characterization and monitoring of defectivity on the partially printed edge die. The methodology includes the development of methods for inspection optimisation requirements, characterization and isolation of defect sources, optimisation of clustering and binning and control of partial die defectivity.
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Byoung-Ho Lee, Tae-Yong Lee, Andrew Cross, Masami Aoki, HeungSoo Choi, and YeonHo Pae "Development of a novel methodology for effective partial die inspection and monitoring", Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72723K (23 March 2009); https://doi.org/10.1117/12.813994
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KEYWORDS
Inspection

Semiconducting wafers

Yield improvement

Defect inspection

Wafer inspection

Reticles

Signal processing

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