Paper
1 April 2009 Chemically amplified hybrid resist platform for i-line applications
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Abstract
Three polymer platforms based on acid labile blocked novolaks were investigated. The first, blended with Polyhydroxystyrene/ t-butylacrylate (PHSC), produced incompatible blends for the most part. Compatible blends were obtained for the second platform by reacting novolak and PHSC together with alkylvinylether, which was optimized for resist performance on Cu substrate at and below 10 μm film thickness. The third platform, based on a modified novolak resin, achieved greater than 5 aspect ratio in 25 μm thick films.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Medhat Toukhy, Margareta Paunescu, Zachary Bogusz, and Georg Pawlowski "Chemically amplified hybrid resist platform for i-line applications", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72730J (1 April 2009); https://doi.org/10.1117/12.816044
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Cited by 2 scholarly publications.
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KEYWORDS
Polymers

Copper

Silicon

Coating

Photoresist processing

Fourier transforms

Gold

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