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1 April 2009 Embedded micro/nano channel formation for three-dimensional negative-tone photoresist microstructuring
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Photoresist lithography has been applied in MEMS (micro electro mechanical systems). The flexible 3D (three dimensional) micro / nano fabrication technique and its process simulation tool have required for 3-D MEMS. This paper presents a UV lithography process simulation for the embedded micro / nano channel formation in a negative-tone photoresist. For its purpose, the moving-mask technology and lithography processes of the negative-tone chemically amplified photoresist are modeled. The simulation algorithm of nano-lithography is applied for micro-lithography. The validity of simulation for the proposed 3D microstructuring is successfully confirmed by the comparison between experimental results and simulated results. Hence, the developed modeling and simulation can discuss and optimize photoresist characteristics and lithography process conditions due to the various pattern formations of micro / nano channels.
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Sang-Kon Kim, Hye-Keun Oh, Young-Dae Jung, and Ilsin An "Embedded micro/nano channel formation for three-dimensional negative-tone photoresist microstructuring", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72730R (1 April 2009);

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