Paper
1 April 2009 Non-topcoat process development for ArF immersion lithography
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Abstract
Mass production of 193-nm immersion lithography has been started. Top coat process is one of the practical solutions for applying the conventional dry ArF resists to achieve low material leaching and good scanning property, etc... At the present, the lithographic world requires non-topcoat process from the point of view of C.O.O. (cost of ownership), however there are still concerns that have to be revealed and solved. In order to achieve higher scan speed, the superior water repellent property is required at the surface of non-topcoat resist. On the other hand, the influence of water repellent surface property to the track process has to be considered. In this report, the considered items (coating, development, etc...) of the higher water repellent property in non-topcoat process were extracted. Material design for optimization of surface property with JSR non-topcoat resist and novel rinse method from process were proposed as solutions to the concerns. Optimization of surface property showed positive impact to the development and defect performance. The novel rinse method "ADR" which has been developed by Tokyo Electron showed superior availability to reduction of blob type defect.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takehiko Naruoka, Nobuji Matsumura, Akimasa Soyano, Shiro Kusumoto, Yoshikazu Yamaguchi, Hiroshi Arima, Yuichi Yoshida, Kousuke Yoshihara, and Tsuyoshi Shibata "Non-topcoat process development for ArF immersion lithography", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727328 (1 April 2009); https://doi.org/10.1117/12.814084
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Cited by 3 scholarly publications.
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KEYWORDS
Surface properties

Water

Immersion lithography

Lithography

Photoresist processing

Thin film coatings

Semiconducting wafers

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