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1 April 2009 Stochastic modeling in lithography: the use of dynamical scaling in photoresist development
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Abstract
The concepts of dynamical scaling in the study of kinetic roughness are applied to the problem of photoresist development. Uniform, open-frame exposure and development of photoresist corresponds to the problem of quenched noise and the etching of random disordered media and is expected to fall in the Kadar-Parisi-Zhang (KPZ) universality class. To verify this expectation, simulations of photoresist development in 1+1 dimensions were carried out with random, uncorrelated noise added to an otherwise uniform development rate. The resulting roughness exponent α and the growth exponent β were found to match the 1+1 KPZ values exactly.
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Chris A. Mack "Stochastic modeling in lithography: the use of dynamical scaling in photoresist development", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72732I (1 April 2009); https://doi.org/10.1117/12.815379
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