1 April 2009 Characteristic three-dimensional structure of resist's distribution after drying a resist solution coated on a flat substrate: analysis using the extended dynamical model of the drying process
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Proceedings Volume 7273, Advances in Resist Materials and Processing Technology XXVI; 727335 (2009); doi: 10.1117/12.814141
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States
Abstract
We extend the former dynamical model of drying process of a resist solution coated on a flat substrate to three-dimensional one. And through numerical simulation of the extended dynamical model we clarified characteristic three-dimensional structure of resist's thickness distribution after drying. And we confirmed characteristic thickness distribution of resist thin film obtained by two-dimensional model through three-dimensional model again.
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Hiroyuki Kagami, "Characteristic three-dimensional structure of resist's distribution after drying a resist solution coated on a flat substrate: analysis using the extended dynamical model of the drying process", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 727335 (1 April 2009); doi: 10.1117/12.814141; https://doi.org/10.1117/12.814141
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KEYWORDS
3D modeling

Polymers

Process modeling

Numerical simulations

Diffusion

Photoresist processing

Polymer thin films

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