Contact analysis studies of an ESCAP resist with scCO2 compatible additives

Abhinav Rastogi; Gregory N. Toepperwein; Manabu Tanaka; Robert A. Riggleman; Juan J. de Pablo; Christopher K. Ober

doi:10.1117/12.813814

1 April 2009 Contact analysis studies of an ESCAP resist with scCO₂ compatible additives

Abhinav Rastogi, Gregory N. Toepperwein, Manabu Tanaka, Robert A. Riggleman, Juan J. de Pablo, Christopher K. Ober

Proceedings Volume 7273, Advances in Resist Materials and Processing Technology XXVI; 72734F (2009) https://doi.org/10.1117/12.813814
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States

Abstract

Rapid technological advances have presented several environmental issues and call for the use of environmentally friendly processes. Supercritical carbon dioxide (scCO₂) is a widely used solvent that can enhance processing performance in photolithography, especially in the development step. Supercritical CO₂ is a good solvent for many nonpolar molecules with low molecular weights. However, it is generally a very poor solvent for high molecular-weight photoresists. Recently researchers have reported the ability to develop conventional polymeric resists in scCO₂ using tailored soluble additives. The mechanism of dissolution of a polymer photoresist in scCO₂ in the presence of these additives is clearly at a very early stage of understanding. To understand this mechanism in more detail, we synthesized a series of scCO₂ compatible quaternary ammonium salts (QAS) and used them as additives in the dry development of model and commercially available photoresists. In this paper, we describe the various interactions that the QAS additive has with the different functional groups on the polymer resist to assist its dissolution in scCO₂. Using contact analysis plots we report the dominant interactions between the additive and the resist material. We report the results with two salts (QAS-I and QAS-II) to show the structure-property relation of these amphiphilic additives with an ESCAP resist. Finally, we report the lithographic evaluation of a commercial EUV resist using an appropriate scCO₂ compatible QAS after development in scCO₂.

Citation Download Citation

Abhinav Rastogi, Gregory N. Toepperwein, Manabu Tanaka, Robert A. Riggleman, Juan J. de Pablo, and Christopher K. Ober "Contact analysis studies of an ESCAP resist with scCO₂ compatible additives", Proc. SPIE 7273, Advances in Resist Materials and Processing Technology XXVI, 72734F (1 April 2009); https://doi.org/10.1117/12.813814

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