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16 March 2009 Lithography line productivity impact using Cymer GLX technology
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Leading-edge scanners in fabs worldwide have particularly high system utilization and require peak levels of system throughput and availability. Laser gas exchanges typically occur daily on these systems (or every 100M pulses or less), with each exchange lasting up to 20 minutes. This downtime has a direct negative effect on availability, and if it is reduced, the productivity of the litho cell increases. This paper will outline the immediate success fabs have experienced after equipping scanners with Cymer's Gas Lifetime eXtension (GLXTM) technology, which increases scanner availability by extending the time between excimer laser gas exchanges by a factor of more than 10. To date, more than 100 leading-edge scanners feature Cymer's GLX technology, which has improved light source availability by more than 1.5 percent. Moreover, multiple chipmakers report more than 2 percent improvement in litho cell productivity due to GLX, corresponding to 2000 wafers/month increase for a 100,000 wafers/month fab. The increase in measured productivity is the leveraged benefit of reducing process interruptions around the refill cycle GLX technology extends the shot-based interval between gas refills to 1 billion pulses for Cymer's XLA light sources, and provides excellent stability in key optical performance parameters, such as bandwidth and dose stability over the entire gas life. This paper will provide extensive performance data during extended light source operation on litho cells equipped with GLX technology, and multiple use scenarios will be examined, including usage at memory and logic fabs. The paper will also discuss the performance of GLX2TM technology which further extends the maximum time between light source gas exchanges from 1B pulses to 2B pulses, and reduces downtime associated with gas refills by a factor of 20. The stability and productivity benefits of this new technology can be realized under all light source utilization scenarios. With GLX2, the refill interval at high utilization chipmakers is 3 weeks, and 4-8 weeks at lower utilization customers. Metrics illustrating the success of each of these capabilities will be presented. The second-generation of GLX technology was launched in July 2008 after chipmakers responded favorably to GLX performance metrics.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kevin O'Brien, Wayne Dunstan, Robert Jacques, and Daniel Brown "Lithography line productivity impact using Cymer GLX technology", Proc. SPIE 7274, Optical Microlithography XXII, 72743N (16 March 2009);

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