13 March 2009 Transistor layout configuration effect on actual gate LER
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Proceedings Volume 7275, Design for Manufacturability through Design-Process Integration III; 72750Y (2009); doi: 10.1117/12.813953
Event: SPIE Advanced Lithography, 2009, San Jose, California, United States
Abstract
The importance of Line Edge Roughness (LER) and Line Width Roughness (LWR) has long surpassed its effect on process control. As devices scale down, the roughness effects have become a major hindrance for further advancement along Moore's law. Many studies have been conducted over the years on the sensitivity of LER to various changes in the materials and the process, which have been considered the main way to tackle the problem - especially through Photoresist improvement. However, despite the increased development of DFM tools in recent years, limited research was done as to LER sensitivity to layout, and the research that was done was limited to proximity effects. In this paper, we study the sensitivity of LER to the layout around the transistor, defined by the gate structure of poly over AA (Active Area). Using different types and geometries of transistors, we found that the poly-gate LER is sensitive to the structure of the Active Area around it (source/drain from gate to contact, both shape and length). Using local LER measurement (moving standard deviation of poly edge location), we found a clear correlation between LER value and the length of the AA/STI boundary located at a close range. Longer AA edges yield higher LER, as proved by comparing gate LER of dog-bone transistor with classical transistor. Based on these results, we suggest that LER is sensitive not only to proximity effects, but also to the layout of underlying layers, through the effect of light scattering of the edges during the lithographic process.
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Guy Ayal, Eitan Shauly, Israel Rotshtein, Ovadya Menadeva, Amit Siany, Ram Peltinov, Yosi Shacham-Diamand, "Transistor layout configuration effect on actual gate LER", Proc. SPIE 7275, Design for Manufacturability through Design-Process Integration III, 72750Y (13 March 2009); doi: 10.1117/12.813953; https://doi.org/10.1117/12.813953
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KEYWORDS
Line edge roughness

Transistors

Lithography

Design for manufacturing

Line width roughness

Optical lithography

Optical proximity correction

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