Abstract
High power Ultraviolet Light-Emitting Diode (UV-LED) is currently in high demand for a variety of applications
including lighting, printing, and polymer curing, with its' advantages of durability, reliability, non-hazardous and safety.
Recently, the technology of Semiconductor Light Matrix (SLM) by multiple individual LEDs mounted on panels was put
forward to obtain higher power for curing application. However, the illumination uniformity of high power LED arrays
still remains an issue. On the other hand, it has been also predicted previously that the lifetime of a device decays
exponentially as the temperature increases. Therefore, the thermal management of high power LEDs is also a critical
factor to the development of high-power UV-LED array light source. This paper presents our latest investigations of
illumination uniformity and thermal management to satisfy the requirements of packaging UV-LED arrays for curing
application.
