21 May 2009 Effects of velocity and pressure distributions on material removal rate in polishing process
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Proceedings Volume 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 72820G (2009); doi: 10.1117/12.830798
Event: AOMATT 2008 - 4th International Symposium on Advanced Optical Manufacturing, 2008, Chengdu, Chengdu, China
Abstract
The distributions of velocity and pressure during polishing process are analyzed in this paper and the effects of which on material removed/removal rate (MR/MRR) are discussed. Usually, polished wafer moves in planetary kinematics pattern, and when the rotation rate of wafer is identical with that of polishing pad the velocity distribution is theoretically uniform from the viewpoint of wafer-pad interface as a whole. On the other hand, when a load is applied to the top surface of wafer pressure distribution is even in the interior of wafer while the pressure sharply increases at the wafer's border, which will inevitably affect the non-uniformity (NU) of MR/MRR, and therefore we have to adjust other parameters, such as rotation rate of pad (or wafer) or improve motion pattern of wafer with respect to polishing pad, to optimize the NU.
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Yaguo Li, Jian Wang, Qaio Xu, Wei Yang, Yinbiao Guo, "Effects of velocity and pressure distributions on material removal rate in polishing process", Proc. SPIE 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 72820G (21 May 2009); doi: 10.1117/12.830798; https://doi.org/10.1117/12.830798
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KEYWORDS
Semiconducting wafers

Polishing

Surface finishing

Interfaces

Glasses

Chemical mechanical planarization

Data modeling

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